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Rapid prototyping and SLA to manufacture prototype HIP tool for the critical components
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HIP bonding of copper to different structural materials
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Tests of bimetallic specimens to verify HIP bonding parameters
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Tensile and creep tests to verify the properties of HIPed materials |
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High temperature tests of porous samples as a data input for process modeling.
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CMM and Reverse Engineering for net shape parts
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HIP process computer simulation based on the proprietary FEM codes
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HIP Bonded Surface Layers (HBSL) to adjust critical components to the harsh environment
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Computer Aided Design (CAD) of the HIP tool
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